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1、W 3234b00 Ob302b3 b8 EIA-3 64-37 ADOPTION NOTICE EIA-364-37, “Contact Engagement and Separation Force Test Procedure for Electrical Connectors,” was adopted on May 22,2000, for use by the Department of Defense (DoD). Proposed changes by DoD activities must be submitted to the DoD Adopting Activity:
2、Commander, Naval Air Warfare Center Aircraft Division, Code 41 4 1 OOB 120-3, Highway 547, Lakehurst, NJ 08733-5 100, DoD activities may obtain copies of this standard from the DODSSP, Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191 11-5094. The private sec
3、tor and other government agencies may purchase copies fiom Electronic Industries Alliance, 2500 Wilson Blvd, Arlington, VA 22201-3834. EIA-364-37 should be used instead of MIL-STD-1344, Method 2014. Custodians: Navy - AS Air Force - 11 Army - CR Adopting activity: Navy - AS (Project 5935- 4203-07) F
4、SC 5935 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Copyright Electronic Components, Assemblies rate of application not to exceed 0.05 1 meter per minute (2 inches per minute). Depth of engagement shd be as specified. Faster rates of application for automatic te
5、st equipment may be used (for inprocess testing oniy). Copyright Electronic Components, Assemblies rate of application not to exceed 0.051 meter per minute (2 inches per minute). Depth of engagement shall be as specified. Faster rates of application for Automatic Test Equipment may be used (for inpr
6、ocess testing only). 4.2.2 The spring member of the contact shall be conditioned by inserting and withdrawing an approved mating component one time unless otherwise specified in the referencing document. 4.2.3 An approved mating component shall be engaged to the specified depth and the force require
7、d to engage the mating component shall be measured. 4.2.4 The mating component shall then be withdrawn and the force required to withdraw the mating component shall be measured. 4.2.5 The mating component shall not be used for frther testing. 4.3 Method C, gauge force This method utilizes GO-NO GO t
8、ype testing, with gauges, to determine whether the spring member contact meets the engagement and separation force limits specified by the referencing document. This method shall be the referee method in case of dispute. 4.3.1 Gauges shall be cleaned prior to use and periodically (typically every 10
9、 cycles) to remove any foreign surface film that may affect the engagement or separation limits. Copyright Electronic Components, Assemblies handle optional. 3 Finish: O. 15 micrometer (6 microinches) to 0.25 micrometer (10 microinches). 4 Plating: None. 1 Figure 1 - Gage pin for socket contact engagement test Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 20:02:26 MDTNo reproduction or networking permitted without license from IHS -,-,-
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