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1、Profiler board&ProfilingDate:2002.05.12Rev.No.:01Approved By:Prepared By:Xiaoping.chen1.Scope:范围范围:This program applies for Temperature Profiling for all product in Flextronics Industrial(zhu hai).适合伟创力实业有限公司所有产品温度曲线的制作适合伟创力实业有限公司所有产品温度曲线的制作.Date:2002.05.12Rev.No.:012.2.Instrument:Instrument:仪器及工具仪器
2、及工具high temperature glue paperhigh temperature solderDATAPAQ9000thermocoupleDate:2002.05.12Rev.No.:013.Thermocouple preparation 准备热电偶线准备热电偶线3.1 Only“K”type thermocouple wire be used for temperature profiling.做温度曲线只能使用型热电偶线Date:2002.05.12Rev.No.:013.Thermocouple preparation 准备热电偶线准备热电偶线 3.2 Ensure th
3、ermocouple wire is minimum 15cm extension from board edge.确定热电偶线从板边延长最少15cmDate:2002.05.12Rev.No.:0115cm4.preparation of profiling board 准备温度曲线测试板准备温度曲线测试板 4.1 Get ready the board for temperature profiling,select the actual product or approximate product as the sample board.用生产产品的板或者近似生产产品的板做为温度曲线的
4、测试样板 4.2 Identify the locations for soldering thermocouple wires.确定焊接热电偶线的位置Date:2002.05.12Rev.No.:01A)A minimum of three points must be measured on a PCB.The three points to be measured are the lead,end and center of the SMD component.一块板上最少有三个测试点,这三个点分别在板面上前,后及中间的元件 4.preparation of profiling boar
5、d 准备温度曲线测试板准备温度曲线测试板Date:2002.05.12Rev.No.:01B)The selection will be based on the coldest and the hottest location on the PCB.在上选择最冷的及最热的位置 1)The coldest will be the most massive component and in the most densely loaded area 最冷的位置在最大的元件和元件最密集的区域 2)The hottest will be the highly exposed or isolated a
6、rea 最热的位置在非常曝露或者单独一个的区域4.preparation of profiling board 准备温度曲线测试板准备温度曲线测试板Date:2002.05.12Rev.No.:01 C)Select the heat sink location 选择吸热多的位置 D)Select the temperature sensitivity component.选择对温度敏感的元件位置 E)Select the thermal shock location 选择有热冲击的位置Note:Refer to the product process instruction for the
7、thermocouple location of the respective products.注意:参考各自产品的工艺流程指示确定热电偶线的位置4.preparation of profiling board 准备温度曲线测试板准备温度曲线测试板Date:2002.05.12Rev.No.:01 4.3 Add high temperature solder to the components termination which had been desoldered.在需要焊接的元件端子加高温锡 4.4 Thermocouple wire will be linked to the re
8、served location.热电偶线连在指定的位置4.preparation of profiling board 准备温度曲线测试板准备温度曲线测试板Date:2002.05.12Rev.No.:014.5 Upon soldering is completed.ensure the following is complied.焊接后,确认是否遵守下列内容:A)No excessive solder cover up the thermocouple termination.没有过多的锡盖在热电偶线的端子上 B)The thermocouple termination(spot weld
9、ed)is fully submerge into the solder without any exposure.热电偶的端子全部焊在焊锡中,没有曝露的4.6 Re-do soldering if it does not comply with the about requirements.如果没有达到要求,重新焊接4.preparation of profiling board 准备温度曲线测试板准备温度曲线测试板Date:2002.05.12Rev.No.:015.Board loading condition 板的传送状况板的传送状况5.1 Flow the profile board
10、 in the unloaded condition during the initial and concurrent stages of profiling.this is to attain an acceptable profile.在起初阶段,炉内没有加载板的情况下,测试的曲线作 为一个初步的可接受的曲线Entry direction进板方向Date:2002.05.12Rev.No.:015.Board loading condition 板的传送状况板的传送状况5.2 For the final profile,flow the profile board under a loa
11、ded condition to simulate a fully production operating condition.Ensure that there are two“production boards”in front of the profile board and one behind.曲线确定以后,再做曲线时以模拟炉内充满的状态 在测试板的前面有两个产品板,在它的后面有一块产品板 Note:“production boards”can either be boards of same product type or of same dimension.注意:产品板既可以是
12、相同的产品或相近似的产品板Date:2002.05.12Rev.No.:01Entry direction进板方向Profile board测试样板Production board产品板5.Board loading condition 板的传送状况板的传送状况Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.1 Solder paste reflow for PCBA process.锡膏焊接工艺锡膏焊接工艺Date:2002.05.12Rev.No.:016.Thermal pro
13、file requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.1.1 The following parameter had to consider on the temperature profile.在温度曲线上必须考虑到下列参数:6.1.1.1 Maximum Pre-heat Temp.Ramp from ambient to soak temperature 从室温到软化保温区的温度的最大的预热温度和斜率 6.1.1.2 Soak temperature and time 软化保温区的温度及时间 6.1.1.3 Reflow temperature and ti
14、me 回流的温度及时间 6.1.1.4 Peak temperature 最高温度Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.2 Wave solder for PCBA process.波峰焊工艺波峰焊工艺Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需
15、要表达的内容温度曲线需要表达的内容:6.2.1 The following parameter had to consider on the temperature profile.在温度曲线上必须考虑到下列参数:6.2.1.1 Pre-heat Temp.and time 预热温度和时间 6.2.1.2 Solder temp.and time 焊锡温度和时间Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:Date:2002.05.12Rev.No.:016.Thermal profi
16、le requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.3 Adhesive curing for PCBA process.胶水固化工艺胶水固化工艺Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.3.1 The following parameter had to consider on the temperature profile.在温度曲线上必须考虑到下列参数:6.3.1.1 Curing temp.and ramp 固化温度及斜率;6.3.1.2 C
17、uring time 固化时间;Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:Date:2002.05.12Rev.No.:016.Thermal profile requirement:温度曲线需要表达的内容温度曲线需要表达的内容:6.4.1 The following parameter had to consider on t
18、he temperature profile.在温度曲线上必须考虑到下列参数:6.4.1.1 the maximum temperature which components can bear.元件本身能承受的最高温度;6.4.1.2 the maximum temperature and longest time on solder point.锡点的最高温度及时间Date:2002.05.12Rev.No.:017.Temperature profile frequency:温度曲线測試温度曲线測試频率:7.1 Normal Process Temperature profile freq
19、uency:正常工藝正常工藝温度曲线测试频率:7.1.1 When there is PP.当试产时;7.1.2 When there is machine change 当机器改变时;7.1.3 When there is a model change 当产品型号改变时;7.1.4 When product quality is out of control 当产品质量超出控制限时;7.1.5 After preventive maintenance 预期的维护之后;7.1.6 Minimum once per week or according to the customers requi
20、rement 最少每周做一次或根据客户需要Date:2002.05.12Rev.No.:017.2 Rework Process Temperature profile frequency:返修工藝返修工藝温度曲线测试频率:7.2.1 When repair for first time;当第一次返修时;7.2.2 When there is apparatus change 当仪器改变时;7.2.3 When there is a model change当产品型号改变时;7.2.4 After preventive maintenance 预期的维护之后;7.2.5 Minimum onc
21、e per week or according to the customers requirement 最少每周做一次或根据客户需要Date:2002.05.12Rev.No.:017.Temperature profile frequency:温度曲线測試温度曲线測試频率:8.How to Use“Reflow Tracker for windows”of temperature profile “Reflow Tracker for windows”温度曲线测试软件的使温度曲线测试软件的使用用 Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01Date:2002.05.12Rev.No.:01
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