聚酰亚胺二层挠性覆铜板的制备与应用.doc
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1、-范文最新推荐- 聚酰亚胺二层挠性覆铜板的制备与应用 摘要本论文选取BPDA、BTDA、p-PDA和ODA为原料,按照二胺和二酐不同的摩尔比合成一系列BPDA-BTDA-p-PDA-ODA型PI前躯体聚酰胺酸(PAA),再通过热亚胺化制备了PI薄膜和PI柔性覆铜板。通过红外光谱(FTIR)、热失重分析(TG)和万能电子拉伸机等方法表征了PAA及PI薄膜的结构、热性能、溶解性、力学性能及其应用于两层柔性覆铜板(2L-FCCL)时的剥离强度和尺寸稳定性等性能。6133结果表明:共聚BPDA-BTDA-p-PDA-ODA型PI的热稳定性好,在氮气氛围中,起始分解温度均超过520,显示出良好的热塑性,
2、拉伸强度可高达78.02MPa,剥离强度高达1.72kgf/cm,并且所制备柔性覆铜板的尺寸稳定性也符合工业标准。关键词聚酰亚胺;热塑性;两层柔性覆铜板毕业设计说明书(论文)外文摘要TitleThe preparation and application of Polyimide resin and cast-on-copper laminateAbstractA series of BPDA-BTDA-p-PDA-ODA copolyamide acids with different composition were prepared in this paper. Polyimide fi
3、lm and two layer PI flexible copper clad laminate(2L-FCCL) were obtained via the conventional two-step thermal process. The mechanical property, morphology, thermal property, dimentionally-stable property and peel strength of PI film and FCCL material were characterized by Fourier transform infrared
4、 spectroscopy(FTIR), thermogravimetric(TG), universal testing machine and the test of weld temperature resistance etc.The results showes that: BPDA-BTDA-p-PDA-ODA copolyimide had good thermal stability. Their initial decomposition temperature are all over 520° C in the nitrogen atmosphere. And t
5、he results also showes the BPDA-BTDA-p-PDA-ODA copolyimide has good thermoplastic. tensile strength of 78.02MPa, peer strength of 1.72kgf/cm.Moreover the dimensional stability of the preparation of flexible copper clad laminate need to be further improved.KeywordsPolyimide; thermoplasticity; two lay
6、er-flexible copper clad laminate 1.1 聚酰亚胺简介聚酰亚胺(PI)是一类以酰亚胺环为特征结构的聚合物1,其具有高模量、高强度、低吸水率、耐水解、耐辐照和优异绝缘性及耐热氧化稳定性等性能2。其作为很有发展前途的高分子材料已经等到了充分的认识,在绝缘材料和结构材料方面的应用正在不断扩大3。1.2 挠性覆铜板简介挠性覆铜板(Flexible Copper Clad Lamination FCCL)以其独特的互连特性,近年来在通信、计算机、汽车和电子等领域获得广泛应用,目前已发展成为一个产值数十亿美元的庞大产业4。挠性覆铜板是生产柔性印刷电路板的基本材料,因此FCC
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