IEC 6352216 2025.docx

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1、IEdition1.02025-04INTERNATIONALSTANDARDNORMEINTERNATIONALEElectricalrelays-Testsandmeasurements-Part16:SolderingRelaiselectriques-Essaisetmesurages-Partie16:Brasage?Us)寸OIneoeeeg690山_THISPUBLICATIONISCOPYRIGHTPROTECTEDCopyright2025IEC,Geneva,SwitzerlandAllrightsreserved.Unlessotherwisespecified,nopa

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14、rgLepremierdictionairedelectrotechnologieenIigneaumonde,avecplusde22500articlesterminologiquesenanglaisetenfranais,ainsiqueIestermesequivalentsdans25Ianguesadditionnelles.EgalementappeleVocabulaireElectrotechniqueInternational(IEV)enIigne.Edition1.02025-04INTERNATIONALSTANDARDNORMEINTERNATIONALEElec

15、tricalrelays-Testsandmeasurements一Part16:SolderingRelaiselectriques-Essaisetmesurages-Partie16:BrasageINTERNATIONALELECTROTECHNICALCOMMISSIONCOMMISSIONELECTROTECHNIQUEINTERNATIONALEICS29.120.70ISBN978-2-8327-0352-6Warning!Makesurethatyouobtainedthispublicationfromanauthorizeddistributor.Attention!Ve

16、uillezvousassurerquevousavezobtenucettepublicationviaundistributeuragree.RegisteredtrademarkoftheInternationalElectrotechnicalCommissionMarquedeposeedeIaCommissionElectrotechniqueInternationaleCONTENTSFOREWORD31 Scope52 Normativereferences53 Termsanddefinitions54 Testprocedure64.1 Purpose64.2 Proced

17、ure64.2.1 General64.2.2 Resistancetosolderingheat64.2.3 Resistancetostandardindustrialsolderingprocesses84.2.4 Solderability5wetting-Wettingbalancedmethod94.3 Conditions105 Evaluation105.1 General105.2 Testreport11Bibliography12Figure 1 -Doublewavesolderingprofile8Figure 2 -SMTandthroughholesolderin

18、gprofile9Table1-TestconditionsfortestTb7INTERNATIONALELECTROTECHNICALCOMMISSIONELECTRICALRELAYS-TESTSANDMEASUREMENTS-Part16:SolderingFOREWORD1) TheInternationalElectrotechnicalCommission(IEC)isaworldwideorganizationforstandardizationcomprisingallnationalelectrotechnicalcommittees(IECNationalCommitte

19、es).TheobjectofIECistopromoteinternationalco-operationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.Tothisendandinadditiontootheractivities,IECpublishesInternationalStandards,TechnicalSpecifications,TechnicalReports,PubliclyAvailableSpecifications(PAS)andGuides(hereafterr

20、eferredtoasIECPubIication(三).Theirpreparationisentrustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealtwithmayparticipateinthispreparatorywork.International,governmentalandnon-governmentalorganizationsliaisingwiththeIECalsoparticipateinthispreparation.IECcollaboratescloselyw

21、iththeInternationalOrganizationforStandardization(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthetwoorganizations.2) TheformaldecisionsoragreementsofIEContechnicalmattersexpress,asnearlyaspossible,aninternationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepre

22、sentationfromallinterestedIECNationalCommittees.3) IECPublicationshavetheformofrecommendationsforinternationaluseandareacceptedbyIECNationalCommitteesinthatsense.WhileallreasonableeffortsaremadetoensurethatthetechnicalcontentofIECPublicationsisaccurate,IECcannotbeheldresponsibleforthewayinwhichtheya

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24、onshallbeclearlyindicatedinthelatter.5) IECitselfdoesnotprovideanyattestationofconformity.Independentcertificationbodiesprovideconformityassessmentservicesand,insomeareas,accesstoIECmarksofconformity.IECisnotresponsibleforanyservicescarriedoutbyindependentcertificationbodies.6) Allusersshouldensuret

25、hattheyhavethelatesteditionofthispublication.7) NoliabilityshallattachtoIECoritsdirectors,employees,servantsoragentsincludingindividualexpertsandmembersofitstechnicalcommitteesandIECNationalCommitteesforanypersonalinjury,propertydamageorotherdamageofanynaturewhatsoever,whetherdirectorindirect,orforc

26、osts(includinglegalfees)andexpensesarisingoutofthepublication,useof,orrelianceupon,thisIECPublicationoranyotherIECPublications.8) AttentionisdrawntotheNormativereferencescitedinthispublication.Useofthereferencedpublicationsisindispensableforthecorrectapplicationofthispublication.9) IECdrawsattention

27、tothepossibilitythattheimplementationofthisdocumentmayinvolvetheuseof（八）patent(三).IECtakesnopositionconcerningtheevidence,validityorapplicabilityofanyclaimedpatentrightsinrespectthereof.Asofthedateofpublicationofthisdocument,IEChadnotreceivednoticeof（八）patent(三),whichmayberequiredtoimplementthisdocu

28、ment.However,implementersarecautionedthatthismaynotrepresentthelatestinformation,whichmaybeobtainedfromthepatentdatabaseavailableathttps:/patents.iec.ch.IECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights.IEC63522-16havebeenpreparedbyIECtechnicalcommittee94:Electricalrelays.ItisanInte

29、rnationalStandard.ThetextofthisInternationalStandardisbasedonthefollowingdocuments:DraftReportonvoting94/1071/FDIS94/1120/RVDFullinformationonthevotingforitsapprovalcanbefoundinthereportonvotingindicatedintheabovetable.ThelanguageusedforthedevelopmentofthisInternationalStandardisEnglish.Thisdocument

30、wasdraftedinaccordancewithISO/IECDirectives,Part2,anddevelopedinaccordancewithISO/IECDirectives,Part1andISO/IECDirectives,IECSupplement,availableatwww.iec.ch/members_experts/refdocs.ThemaindocumenttypesdevelopedbyIECaredescribedingreaterdetailatwww.iec.ch/publications.AlistofallpartsofIEC63522series

31、publishedunderthegeneraltitleElectricalrelays-Testsandmeasurements,canbefoundontheIECwebsite.ThisInternationalStandardistobeusedinconjunctionwithIEC63522-0:-Underpreparation.Stageatthetimeofpublication:IECCDV63522-0:2024.Thecommitteehasdecidedthatthecontentsofthisdocumentwillremainunchangeduntilthe

32、stabilitydateindicatedontheIECwebsiteunderwebstore.iec.chinthedatarelatedtothespecificdocument.Atthisdate,thedocumentwillbe reconfirmed, withdrawn,or revised.ELECTRICALRELAYS-TESTSANDMEASUREMENTS-Part16:Soldering1 ScopeThispartofIEC63522isusedfortestingalongwiththeappropriateseveritiesandconditionsf

33、ormeasurementsandtestsdesignedtoassesstheabilityofDUTstoperformunderexpectedconditionsoftransportation,storageandallaspectsofoperationaluse.Thisdocumentdefinesastandardtestmethodforresistancetosolderingheatandsolderabilityforstandardsolderingprocesses.2 NormativereferencesThefollowingdocumentsareref

34、erredtointhetextinsuchawaythatsomeoralloftheircontentconstitutesrequirementsofthisdocument.Fordatedreferences,onlytheeditioncitedapplies.Forundatedreferences,thelatesteditionofthereferenceddocument(includinganyamendments)applies.IEC60068-2-20:2021,Environmentaltesting-Part2-20:Tests-TestTaandTb:Test

35、methodsforsolderabilityandresistancetosolderingheatofdeviceswithleadsIEC60068-2-69,Environmentaltesting-Part2-69:Tests-TestTe/Tc:Solderabilitytestingofelectroniccomponentsandprintedboardsbythewettingbalance(forcemeasurement)methodIEC61760-1:2020,Surfacemountingtechnology-Part1:Standardmethodforthesp

36、ecificationofsurfacemountingcomponents(SMDs)IEC63522-0:-Underpreparation.Stageatthetimeofpublication:IECCDV63522-0:2024.3,Electricalrelays-Testsandmeasurements-Part0:GeneralandguidanceIEC63522-1:-Underpreparation.Stageatthetimeofpublication:IECFDIS63522-1:2025.4Under,Electricalrelays-Testsandmeasure

37、ments-Part1:VisualinspectionandcheckofdimensionsIEC63522-7:-4,Electricalrelays-Testsandmeasurements-Part7:FunctionaltestsIEC63522-11:2025,Electricalrelays-Testsandmeasurements-Part11:EnclosureprotectionanddegreeOfprotection3 TermsanddefinitionsForthepurposesofthisdocument,thetermsanddefinitionsgiven

38、inClause3ofIEC63522-0:-andthefollowingapply.ISOandIECmaintainterminologydatabasesforuseinstandardizationatthefollowingaddresses: IECElectropedia:availableathttps:/www.electropedia.org/ ISOOnlinebrowsingplatform:availableathttps:/www.iso.org/obp3.1surface-mounteddeviceSMDdevicewheretheelectricalconne

39、ctiononthesurfaceofaconductivepatternisrealizedwithoututilizingcomponentholes4Testprocedure4.1 PurposeThesestandardmethodsareabasicqualificationfortheresistanceofsolderprocessesunderstandardconditionsorindividuallyasdefinedbythemanufacturer.Thefinalproductfittingtheselectedsolderprocessshallbeinvest

40、igatedbytheusersundertheirresponsibility.Eachkindofdeviationfromthegiventestconditionsorprocessshallbeexplicitlydescribedinthetestreport.Insuchcaseitisnotallowedtoreferenceatestasaccordingtothisdocument.Ifthereisanydeviation,thetestreportshallbenamedassimilarto.Todetermine theabilityofrelayterminals

41、toweteasilywithsolder, and/ortheabilityoftherelaytowithstandsolderingheat,solderterminalsandtheirsupportsshallhaveasufficientresistancetoanysolderingheat.Thesetestsareonlyapplicabletorelaysandsocketswherethemanufacturerhasspecifiedtheabilityofterminationstoasolderingprocess.NOTETherearesomeindustria

42、lrelayswheretheterminalcouldbeusedinconjunctionwithflat-quickconnectoraswellasdirectwiresoldered.4.2 Procedure4.2.1 GeneralThefollowingsolderingheatresistancetestsaredefinedasstandardtestsforrelays.4.2.2 Resistancetosolderingheat4.2.2.1 Method-Solderingironmethod4.2.2.1.1 PurposeTheobjectofthistesti

43、stoevaluatethesolderabilityofrelayterminationsandabilitytowithstandtheheatingstressproducedbysolderingiron.4.2.2.1.2 ProcedureThetestiscarriedoutaccordingtotestTbofIEC60068-2-20asgiveninTable1formethod2ortheconditionsindividuallyspecifiedbythemanufacturer.TheconditionsofIEC60068-2-20arerecommended,b

44、utifsolderingisdifficult,theconditionsshallbestatedindividuallybythemanufacturer.AfunctionaltestaccordingtoIEC63522-7shallbeperformedbeforeaswellasafterthesoldering.4.2.2.2 Method-Solderbath4.2.2.2.1 PurposeTheobjectofthistestistodetailastandardtestmethodtoevaluatethesolderabilityofrelayterminations

45、towithstandtheheatingstressesproducedbyamasssolderingoperation.4.2.2.2.2 Procedure4.2.2.2.2.1 GeneralThetestiscarriedoutaccordingtotestTbofIEC60068-2-20asgiveninTable1.AfunctionaltestaccordingtoIEC63522-7shallbeperformedbeforeaswellasafterthesoldering.Table1-TestconditionsfortestTbSubclausesofIEC600

46、68-2-20:2021Conditions5.1.2FunctionaltestaccordingtoIEC63522-7asinitialmeasurementMethod15.2.4Method1A:solderbathat(2603)5.2.4Durationofimmersion:(50,5)s5.3.3Method2:solderingironat350Method25.3.1SolderingironofsizeB5.3.3Nocoolingdevice5.3.3Durationofapplicationofthesolderingiron:(101)s4.2.2.2.2.2 S

47、olderpins(terminals)ThetestiscarriedoutaccordingtotestTbofIEC60068-2-20asgiveninTable1formethod1.Terminalsformountingonprintedcircuitboardsshallbefittedwithathermalscreen(simulatingaprintedboard)of(1,50,1)mmthickness.Duringthetest,immersionshallbeeffectuatedonlyuptothelowersurfaceofthisscreen.Thescr

48、eenshallbeusedinsteadofaprintedcircuitboard(PCB).NOTEToavoidanyinfluencefromthescreentothewetting,screenswithholediameters1mmlargerthanthepinsizearecommonlyused.4.2.2.2.2.3 Othersolderterminations(e.g.solderinglugs)Thistestshallbecarriedoutasindicatedbythemanufacturerinaccordancewithtestmethod1asgiveninTable1.4.2.2.3 Terminalsforsurfacemounting(SMD)Thistestsh